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Technical specifications

Technical specifications
 

Technical specifications

S.No Description Capability
1 Layer Count 2-24 Layers
2 Complex Boards 4/4 with BGA
  Minimum Hole Dia 4 MIL(0.1 mm)
  Maximum Board size 450 x 400 mm
3 Board Thickness 0.2 mm to 10 mm
4 Heavy Copper Boards 210 microns
5 Surface Finishes ENIG/HASL(TIN-LEAD)
6 Special Materials Rogers /Arlon /Taconic ( Supplied By Customer)
7 Impedance Control Single and Differential
8 Solder Mask Colours Green,Red,White,Black,Blue & Purple
  Via filling Non Conductive Ink
9 Legend color&Min legend line width White,Black and yellow-3 mil min legend line width
10 Special Profiling PCBs With Multiple Shape Profiles
11 PCBs in Arrays Arrays According to Customer Requirement
12 Special PCBs Blind and Burried Vias
    Via in pad PCBs
    Aluminium Metal Core