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Technical specifications

Technical specifications

Technical specifications

S.No Description Capability
1 Layer Count 2-24 Layers
2 Complex Boards 4/4 with BGA
Minimum Hole Dia 4 MIL(0.1 mm)
Maximum Board size 450 x 400 mm
3 Board Thickness 0.2 mm to 10 mm
4 Heavy Copper Boards 210 microns
5 Surface Finishes ENIG/HASL(TIN-LEAD)
6 Special Materials Rogers /Arlon /Taconic ( Supplied By Customer)
7 Impedance Control Single and Differential
8 Solder Mask Colours Green, Red, White, Black, Blue & Purple
Via filling Non Conductive Ink
9 Legend color White, Black and yellow
10 Special Profiling PCBs With Multiple Shape Profiles
11 PCBs in Arrays Arrays According to Customer Requirement
12 Special PCBs Blind and Buried Vias
Via in pad PCBs
Aluminium Metal Core