State-of-the-Art PCB Infrastructure
Advanced in-house infrastructure delivering multi-layer prototype PCBs with unparalleled accuracy, speed, and industrial reliability
Innovative PCB Production Infrastructure
Advanced Multi-Layer PCB Production Facility with Precision Engineering
Our in-house facility combines modern equipment, expert engineering, and stringent process control to deliver multi-layer prototype PCBs with unmatched quality and efficiency.
Design & Planning
- Integrator software for rapid quotation
- Impedance control with Speed Stack & Coupon Generator
- DFM software: UcamX and CAMMaster
- Photo plotter and photographic film processor
Layer Processing & Fabrication
- Inner layer registration welding machine
- Brown oxide line
- Multi-layer vacuum lamination (pressing)
- CNC drilling machines – 7 spindles
- Mechanical brushing unit
- Desmear Electroless Automated Line
- Dryfilm photoresist laminator
- Laser Direct Imaging (LDI)
- Electroplating copper and tin line
- Dryfilm photoresist stripping machine
- Etching and tin stripping machine
- Mec etch surface cleaning line
- Inkject legend printing
- Vertical hot air leveling machine
- ENIG line
- CNC routing machines – 4 spindles
- Wastewater treatment plant (RO) for environmental compliance
Testing & Quality Control
- Automated Optical Inspection (AOI) for defect-free boards
- Video measuring equipment
- CMI-hole wall copper thickness measuring equipment
- CMI-surface copper thickness equipment
- Fly probe testers – 3 units
- Control impedance testing equipment
Controlled 8-Stage Production Flow
Production Workflow
- Design & DFM : Gerber review, DFM check, quotation, film output
- Inner layer imaging : LDI exposure, develop, etch, brown oxide treatment
- Lamination : Registration welding, vacuum press bonding
- CNC drilling : 7-spindle drilling, desmear, electroless copper
- Outer layer imaging : Dryfilm laminate, LDI, plate Cu/Sn, strip, etch
- Surface finish : HASL or ENiG applied per specification
- Testing & inspection : Fly probe, AOI, impedance, CMI thickness check
- Routing & dispatch : CNC profile, legend print, final QC, shipment
What Sets Our Facility Apart
Why choose our facility
Four reasons engineers trust us with their most critical builds
Fully in-house production
No outsourcing at any stage. Every process from DFM to final test happens under one roof, giving you complete traceability and zero handoff risk.
End-to-end quality control
AOI, fly probe testing, impedance measurement, and CMI thickness checks are applied to every board not sampled, but every unit.
Laser-precision imaging
Laser Direct Imaging eliminates film registration errors, delivering sub-25 µm accuracy on outer layers and consistent yields on tight-pitch designs.
Environmentally responsible
Our on-site reverse osmosis wastewater treatment plant ensures full regulatory compliance and responsible discharge meeting the highest environmental standards.
Ready to start your next build?
Upload your Gerber files for a free DFM review and instant quotation. Our engineers respond within 2 hours.
