Multilayer PCB Manufacturer in Bangalore

Every layer you add to a board is another chance for something to drift out of place.

Multilayer PCB

Layer Logic

Multilayer PCB Stack-Up Design That Holds Under Load

We fabricate up to 24 layers using laminate stack-ups matched to your board’s electrical and mechanical requirements: FR4 for standard multilayer builds, Rogers substrates where high-frequency performance calls for it. Stack-up planning happens before the first panel is cut, not adjusted mid-run, because a stack-up decided late is a stack-up that compromises later.

As a high layer count PCB manufacturer, registration accuracy is the variable that decides whether a 24-layer board actually performs as designed. We use Laser Direct Imaging (LDI) specifically for layer-to-layer registration, holding sub-25 micron accuracy so each inner layer lands where the stack-up called for it, not close to it. That precision compounds in your favour as layer count rises.

Up to 24 layers

FR4 and Rogers stack-ups engineered per board.

LDI registration

Sub-25 micron accuracy, layer to layer.
Multilayer PCB

Built to Spec

Custom Multilayer PCB Builds for Complex Requirements

Not every multilayer board is solving the same problem. Some need density without added board area. Some need to carry serious current without overheating. Some need signal integrity held across a dozen layers at once. A custom multilayer PCB build starts with which of those problems your design actually has, not a standard spec sheet.

Blind and buried vias fit into a multilayer stack-up when routing density demands it, connecting inner layers without drilling through the whole board. Controlled impedance is held across every layer that carries a high-speed signal, not just the outer ones. Heavy copper layers sit inside the same stack where a board needs to move real current without the extra layers adding thermal risk.

One Roof

In-House Multilayer PCB Fabrication Services, Start to Finish

Every stage of your multilayer PCB fabrication happens on our floor, not handed off between vendors. As a multilayer PCB manufacturer in India built for 24-layer output, we hold that same in-house control at volume. No layer’s process step gets outsourced, which means no handoff risk on a build where a single weak step can undo everything above and below it.

Step 1

Drilling

Precision-controlled for every internal layer.

Step 2

Lamination

Pressed and bonded under one process line.

Step 3

Plating

Copper plating done in-house, panel to panel.

Step 4

Testing

Verified before it ever leaves the facility.

Where Layers Go Wrong

Multilayer PCB Manufacturer, Built for 24-Layer Precision

Add a layer to a PCB and you add a new point where registration can shift, where impedance can drift, where a plane can misalign against the one above it. A four-layer board tolerates small errors that a sixteen-layer board can’t hide. By the time you’re at 24 layers, a single misregistered inner layer can take out signal integrity across the whole stack, and that failure won’t show up until the board is already in a system.

Multilayer PCB manufacturing at this depth is not the same discipline as fabricating a two-layer board faster or cheaper. It’s a question of whether the fabricator’s process holds tolerance consistently, layer after layer, on every panel, not just the first one off the line. PC Process runs multilayer PCB manufacturing in Bangalore up to 24 layers, with the layer-to-layer registration control that high-layer-count boards demand, and 43 years of production discipline behind it.

If your board’s reliability depends on what happens between the layers, that’s exactly the part of the process we built around.

Inside the Stack

Inspection That Goes Deeper Than the Outer Layer

A 24-layer board hides defects a two-layer board never could. Every board gets 100% inspection, not sampling, layer by layer through the stack.

AOI Inspection

Catches outer-layer defects before a board moves further down the line.

Fly Probe Testing

Verifies electrical continuity through the full stack, not just top and bottom.

Impedance Measurement

Confirms every high-speed layer performs to spec, inner layers included.

CMI Thickness Checks

Runs per layer, catching copper variance before it reaches the field.

Registration Verification

Confirms inner layers land exactly where the stack-up called for.

100% Coverage

Every board inspected, not a sample batch pulled from the run.

Built for Reliability

Multilayer PCBs for Defence, Aerospace, and Industrial Systems

A multilayer board built for a consumer product and one built for a satellite payload face different consequences when something goes wrong. We build for the second kind. A multilayer PCB manufacturer for aerospace needs LCSO certification under JSS 52302, not just an ISO badge. A multilayer PCB manufacturer for defence electronics needs the same. We hold both.

Defence electronics

LCSO-certified multilayer boards under JSS 52302.

Aerospace & space

High-reliability stack-ups for mission-critical systems.

Medical electronics

Multilayer boards where failure isn't an option.

Telecom infrastructure

Signal-dense builds for high-speed networks.

Industrial automation

Multilayer PCBs built for continuous operation.

Research institutions

Custom stack-ups for specialised applications.

Our Clients

Four Decades of Multilayer PCB Manufacturing, Since 1983

PC Process has fabricated multilayer boards from the same Bangalore facility since 1983, under Managing Director S. Radhakrishnan. ISO 9001:2015 and LCSO/JSS 52302 certifications back that record, and clients including ISRO (via VSSC), HAL, BEL, and BHEL have run high-layer-count boards through this same process.
What is the maximum layer count PC Process can manufacture?
PC Process manufactures multilayer PCBs up to 24 layers, using FR4 and Rogers substrates matched to each board’s stack-up requirements.
Yes. Our engineers review your stack-up before fabrication, checking layer sequencing, material selection, and impedance requirements against your design.
Yes. PC Process is LCSO certified under JSS 52302, the Indian defence supplier standard, alongside ISO 9001:2015 certification for quality management.
We fabricate multilayer boards in FR4 for standard applications and Rogers materials for high-frequency and RF-specific multilayer requirements.
Yes. Blind and buried vias are built into multilayer stack-ups where routing density requires inner-layer connections without full-board drilling.
Yes. Impedance is measured and verified across every signal-carrying layer in the stack, not limited to outer layers alone.
Yes. Multilayer boards undergo fly probe testing, per-layer CMI thickness checks, and impedance measurement across internal layers, not just outer-layer AOI.
Yes. Heavy copper layers can be built into a multilayer stack-up for boards that need to carry higher current loads.
Yes. Drilling, lamination, plating, and testing all happen within our Bangalore facility, with no stage outsourced to a third party.
We manufacture multilayer PCBs for defence, aerospace, medical electronics, telecom, industrial automation, and research sector applications.

Stack FAQs

Multilayer PCB Manufacturer FAQs

Straight answers to the questions engineers and procurement teams ask most before ordering a high layer count multilayer PCB from PC Process.

Send Your Stack-Up. We'll Tell You What Holds.

Upload your Gerber files and layer stack-up for a free DFM review before fabrication begins.

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